400-9988-118
|
Remove individual layers of mold compound down through the lead frames to the substrate. 100% controllable by the operator through our Graphic User Interface. Full, Localized，or Bevel Decapsulation can be achieved. Reduces the amount of chemical processing necessary. Application Examples Package Pre-opening: plastic, ceramic and MEMS Pre-cavitation of power devices Circuitry can often be revealed without acid Complex-shaped cavities can be made Exposure of components without destruction of Al, Cu, Au bond wires For applications requiring subsequent acid cleanup,low temperature, low corrosion conditions can be used. Glob top removal (Wlip chipped or wired dies on PCB or Ceramic) Cross section preparation Bonding cut Thin PCB cut
Product Specification
|
About Us|Honor|Products|Contact Us
Copyright ? 京ICP 06010381
